BGA Rework, CSP Rework, SMT Rework: DRS25

DRS25
Semi Automated SMT Rework & Repair
Factory Reconditioned - 1 Year Warranty

Lead-Free Rework & Repair of BGA's, CSP's, Flip Chip, SMT and 0201's

DRS25's are available in four configurations (see below).

BGA Place

Component Flux

Site Pad Cleaning

Key Benefits:
Effective Lead-Free Rework- New large, powerful, radiant IR panel preheater provides the capability to preheat any assembly to higher temperatures required for lead-free rework.
• High thermal uniformity based on proprietary design.
• No air consumption or noise.

Rapid Assembly Cooldown - New Board Cooling System
provides rapid cooldown of the component and assembly.
• Ability to control time over reflow.
• Promotes operator safety. Comfortable board handling
and reduced machine preheater surface temperatures.

Greater Stability/Flexibility - New Enhanced Board Carrier provides increased stability and greater flexibility for various assemblies.
• Expanded board holding capability.
• Insulated knobs for increased operator safety.

NEW Control System - Adds the latest USB interface
technology for a very stable communication platform.

Auto Profiling Capability - New Profile Tutor Software provides fast and easy, first run, automatic thermal profile of any device with on-the-fly capability. Simply set the target temperatures and go. After thermal profile is complete, the entire rework process (removal, site cleaning and replacement) is built automatically and ready to run immediately.

Automated Micro Site Cleaning
• Standard & Micro Tip Site Clean Assembly with a high
temp, non-abrasive, composite vacuum micro tip with
an inside diameter as small as 0.063".
• Composite vacuum tip with automatic height adjustment,
compensates for variable residual solder volume.
• Eliminates potential damage to pads or solder mask
caused by contact-based methods.

Custom Nozzle Design - Air-Vac has made thousands of nozzles for virtually any type of surface mounted device
including an expanding line of BGA and connector nozzles.

Features/Benefits
IR Preheater
Insulated heating elements throughout the entire preheat surface provides ultra-fast heat up with excellent thermal uniformity. Black ceramic, high-emissive coating dramatically increases radiant energy, providing the capability to preheat high thermal mass boards to the significantly higher preheat temperatures required for lead-free rework.

Board Cooling System (optional)
The optional board cooling system (Air Knife) provides air flow (blue arrows) between the preheater and the bottom of the board for fast, controlled cool down of the solder joints and board.

Profile Tutor Software
Provides fast and easy thermal profiling of lead-free and tin lead devices with adjust on-the-fly capability. Simply set the target temperatures and go. After the thermal profile is complete, the entire rework process (removal, site cleaning and replacement) is built automatically and ready to run immediately.

Processing Speed & Reliability
The DRS25 features next-generation Digital Signal Processing (DSP) combined with a FireWire computer interface which provides instantaneous machine response and improved machine reliability.

Automation Makes Lead Free Rework Fast & Easy
Motorized Vision and Z-Axis provide automatic component pick-up and removal. Automated placement of even the most sensitive devices is accomplished with the precision force measurement system with real time display.

Colored LED's Simplify The Alignment Process
Top (green) and bottom (white) LED's with independent, programmable intensity adjustment simplify the alignment processcby providing colored differentiation of component leads/spheres and pads.

Automated 0201 Rework
The DRS25 provides the extreme precision and accuracy required for reworking these extremely tiny devices. Proprietary hot bar nozzle technology with integrated hypodermic vacuum pick up provides ramp-controlled conductive heating which prevents thermal shock
and prevents adjacent 0201 devices as close as .010" away from reflowing.

The World's Most Advanced Nozzle Technology
Air-Vac's wide array of hot gas, hot bar and heat through nozzles are designed to handle any application, providing customers the ability to grow with changing technology.

Options: Pivoting IR Probe with Laser Pointer #1012.02.017 • Provides process repeatability by insuring that the board is at the exact same target temperature each time before localized reflow begins. • Operator is instructed to position the sensor at the beginning of the process. • Laser point provides a visual reference to the center of the IR sensor verifying position over the substrate at the same location as profiled. • Pivot function allows positioning on small boards without interference of the nozzle heating throughout the rework processes. • Non-contact temperature sensor monitors topside board temp and triggers localized reflow process once the target temperature is reached.

Site Cleaning System #0025.04.010 • Includes Standard and Micro nozzles. • High temperature composite vacuum tip eliminates metal-to-metal contact. • Vacuum sensor automatically and continuously adjusts tip height, providing non- contact site cleaning. • Various size heating noses and tips provide the ability to clean virtually any site. • Ready-to-use site cleaning master programs for fully automated solder removal. • Download Literature

Direct View Camera with 20" Video Monitor #0025.03.010 • Provides high magnification site viewing including the ability to verify when component reflow has occurred. • Operator positions the camera on the site. Focus, zoom, and lighting adjustments are made to optimize clarity. The image is displayed on a flat screen monitor. • A valuable process development aid especially for difficult to see tiny solder joints. • Recommended for use in conjunction with the automatic site cleaning system to verify cleaning on dense assemblies. • Recommended for the dispensing option to provide dispense inspection capability.

Site Cleaning Kits - Standard & Micro Nozzles • Single Standard Kit includes nozzle, one nose length and two tip sizes (.188 x .125) and (.125 x .089). #1015.11.013 • Single Micro Kit includes nozzle, two noses (different lengths) and three tip sizes (.09 x .060), (.074 x .042) and (.05 x .025). #1015.11.016 • Combination Micro & Standard Kit includes both of the above. #1015.11.017 • Click here for Nozzle Kit Parts breakdown and cleaning instructions

Dipping Kit for Solder Paste or Flux #FASET1 • Superior to applying paste via component or board stencils • Easier process, less operator involvement than stencils (consistent results) • No component or board/pad coplanarity preparation issues • No adjacent interference issues • Excellent for extremely fine pitch, sphere or leaded size components • One set of dipping pedestals replaces dozens of custom component stencils

Ergonomic Workstation with CPU Holder #1003.05.010 Monitor Stand Option for Workstation #1003.05.005 Nozzle Stand Option for Workstation #1003.05.006 Locking Drawer Option for Workstation #1003.05.007 • Workstaton provides a self contained work cell environment for the machine and operator. Dimensions are 60"W X 36"D. Very sturdy construction with anti-static laminate surface. (Workstation includes CPU holder, everything else is an add on option).

Universal Insertion Tool #AU6LGA47R Mechanically self-centers any square or rectangular device for accurate pick up. Used in conjunction with vision system component tray. Component Range: 6-47mm devices.
DRS25 Model Configurations
· Model · Description · Preheater - size - zones - watts · Board Size · Clearance - topside - bottom	DRS25 Standard machine 16" x 16" 2 5000 18" x 24" 1.0" 1.0"	DRS25XL Extra large boards 24" x 16" 3 7500 24" x 24" 1.0" 1.0"	DRS25T Extra topside clearance 16" x 16" 2 5000 18" x 24" 2.3" .97"	DRS25XLT XL boards & extra top clearance 24" x 16" 3 7500 24" x 24" 2.3" .97"