General
All nozzles are interchangeable between ONYX and DRS systems. Air-Vac can deliver special nozzles to meet your exact requirements. We've designed and manufactured
over 4,000 nozzles since 1988.

Click for a list of Universal BGA/CSP Nozzles that are readily available. For nozzles for smaller or larger components than those listed, please contact Air-Vac.
 

Nozzle Selection - Rework
If you know your Air-Vac nozzle part number, click here for a quote, or;

If you know your component type, select from the list below (PDF), or;

If you require a nozzle that is not listed, or are having trouble determining
which style nozzle best suits your application, please click here and send a
Manufacturers Mechanical Drawing (PDF) of your Component.
 

BGA's - MBGA, CSP, C4, Flip Chip (<6mm) BGA's - MBGA, CSP, C4, Flip Chip (>6mm) BGA's - PBGA (plastic) BGA's - TBGA (tape) BGA's - CBGA/CCGA (ceramic ball/column) BGA's - SBGA/ESBGA (super/enhanced) BGA's - Sockets & Connectors Carrier's - PLCC (plastic leaded chip) Carrier's - LCC (leadless chip) Carrier's - LCCJ (leaded chip J-bend) Carrier's - TAB (tape packages) Connector's - NexLev Connector's - Mictor Right Angle Connector's - Mictor Vertical Connector's - Surface Mount Integrated Circuit's - SOIC (small outline)

Outline Packages - TSOP (thin small) Outline Packages - SSOP (shrink small) QFP's - PQFP (plastic) QFP's - BQFP (bumper) QFP's - Hot Bar Nozzles QFP's - TQFP (thin) Socket's - PLCCS (plastic) Miscellaneous - Passive Miscellaneous - Odd Shape/Sizes Miscellaneous - Multi-Chip Modules

Integrated Circuit's - SOJ (small outline  J-lead)


Nozzle Selection - Site Cleaning (ONYX)
Micro Tip Site Clean Assembly #1015.11.059


Nozzle Accessories
Adjustable Insertion Tool


Nozzle Technology Overview
Explanations & Drawings.