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NOZZLE TECHNOLOGY
 

Hot Gas, Hot Bar & Heat Through
 Convection-based reflow results from energy transfer of hot gas to the solder joint. The closer to the solder joint that this hot gas can be contained, the more efficient the energy transfer will be. Due to this fact, a basic nozzle design rule is to terminate the nozzle exhaust as close to the PCB leads as possible without obstructing the viewing angle. Hot nitrogen can be utilized when oxidation of the solder joint is a concern.

  
  Hot Bar Technology
Air-Vac utilizes a unique combination of convection and conduction heating to achieve reflow by placing a titanium blade on top of the component lead foot. Titanium is used due to its solder wetting properties, which allows it to be held in molten solder while the solder is allowed to solidify.

This technology provides the most efficient method of reflow. In some instances, process times have been reduced by as much as 50%. This style nozzle can be used to address the following issues:

- fine pitch devices where lead-to-pad
  coplanarity is critical
- multi-layer assemblies with ground
  planes or heat sinks which require
  conductive heating to achieve proper
  reflow.
- large, fine pitch surface mount
  connectors
Heat Through Technology
A controlled gas flow is directed to the top of an area array package (i.e. BGA, CSP, Flip Chip) allowing the device itself to act as a heat spreader by conducting heat to the hidden solder interconnects.
 

 


 
 

EZ & DVG Style Nozzles
· Universal design - not package
  specific
 · Immediate availability
 · Zero adjacent component
  clearance (adjacent components
  within .300" may reflow)
 · Fewer nozzles required

X & M Style Nozzles
 · Component-specific design
 · Four-sided exhaust ports
  minimize adjacent
  component temperatures
 · Anti-crushing feature
 · Adjacent component clearance
  requirements: X=.100, M=.032		  

  ACG Style Nozzles
 · Component-specific design
 · Oversized heating tube optimizes thermal performance
 · Torlon corner standoff eliminates placement height
  concerns
 · Adjacent component clearance=.200"
 · Low profile ACG design also available (.100" clearance
  requirement)
 

Connector Rework
The proliferation of surface mount connector technology is evidence of the continued push to convert through-hole components to surface mount technology. In addition to standard lead-only connectors, Mictor and BGA connectors are also growing rapidly.

Air-Vac has several years of experience in the areas of design, manufacturing and process development for rework of surface mounted connectors. Several unique features of our connector nozzle designs include adjustable chambering to balance the heat across the entire length of the connector, adjustable height inserts which allow connectors with the same x/y dimensions but different heights to be reworked, and extraction mechanisms that enable the connector to be removed after reflow.
 



Connector Nozzle
Connector Nozzles incorporate both surface mounted leads as well as through-hole pins and are designed in various lengths up to four (4) inches and can be surface or straddle mounted.
Nexlev Connector Nozzle
BGA connectors utilize solder spheres instead of leads or pins to form the solder joint. One popular example of BGA connector technology is the Nexlev series of connectors from Teradyne. 		 


 
 



 

 

   Large Surface Mount
Connector Nozzle
Air-Vac has designed some extremely large connector nozzles which incorporate embedded heating elements to eliminate heat sink effects of these extremely large nozzles.