Air-Vac ONYX29 Rework & Assembly

Precision Placement Accuracy

Overview

The ONYX29 from Air-Vac represents the future of Lead-Free
rework and low volume assembly of emerging electronic and Microelectromechanical Systems (MEMS) technology. These technologies will require significantly enhanced capability in part handling, micro-force pick and place control, dispensing, alignment, placement accuracy, preheat and precision reflow control; requirements far beyond the capability of current semi-automated
or manual processes.

	Applications ONYX29 applications include Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF’s and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.
	0201		Flip Chip		Micro Leaded Component

Software Interface

Micro Component Pick & Place

Fine Dot Dispensing

Fully Automated Site Cleaning

Features/Benefits

Seven Axes of High Automation
• Control of X, Y, Z, Theta, Vision Zoom, Vision X & Vision Y.

Multiple Field of View (MFOV)
• Automatically indexes the camera to the four corners of large
components up to 75mm.

Visual Machines^TM Software
• Graphical user interface provides a visual representation of the
board and component locations to the operator. One or multiple
component sites can be reworked during a single cycle.
• Expanding component library includes ready-made process
sequences and thermal parameters for Tin/Lead and Lead-Free
components.

Automated Precision Component Pick-Up
• Multi-position pick capability from large and small waffle trays, gel
packs, tape and reel, and single component nest.

• Precision Micro-Force sensing provides the extremely low force
needed to pick tiny, fragile devices.

Dispensing Technology
• Rework and low volume assembly of emerging technology
typically requires integrated precision dispensing of solder paste,
flux, epoxy or underfill.

Lead-Free Requirements
• Powerful 2000 watt top heater.
• Infra-red (IR) bottom heating technology. The heating element
provides extremely uniform preheat over the entire surface. The
bottom heating panel is 19" x 19" and features four (4)
independently programmable heating zones (1400 watts per zone,
5600 watts total).
• Programmable cold air injection and linear air knife provide
precise cool down control to optimize time over reflow.
• Interactive thermal profiling provides "on-the-fly" adjustments.

Proprietary Non-Contact Site Cleaning
• NEW Micro Tip Site Clean Assembly (#1015.11.059) with a high
temp, non-abrasive, composite vacuum micro tip with an
inside diameter of 0.063".
• Composite vacuum tip with automatic height adjustment,
automatically compensates for variable residual solder volume.
• Eliminates potential damage to pads or solder mask caused by
contact-based methods.
• Especially critical for removal of Lead-Free solder with higher
reflow temperature and for micro site cleaning of small, fragile
pads/solder mask. Programmable micro tips remove solder from
small sites without affecting adjacent devices.
• Powerful heat and vacuum, combined with high efficiency bottom
heating, can also remove solder from barrels of through hole and
Mictor connectors.
• Conductive heating/vacuum tips remove solder from 0201 and
other pads where convective site cleaning can not be used.

Automatic Component Shuttle

Options

ONYX29 Option Sheet (PDF download) includes:

• 70mm (2.75") Top Side Clearance
• Site Cleaning System
• IR Sensor
• Board Cooling System
• Universal Insertion Tool
• Automatic Component Shuttle
• Paste-On-Device Micro Stencil Adapter
• Flux Dip Pedestals
• Direct View Camera & Mount Assembly
• Dispensing System
• Fume Extraction Manifold
• Ergonomical Workstation