Micro Assembly & Micro Dispensing: ONYX500 Production Cell

ONYX500 Production Cell
High Precision, Low Volume Micro Assembly, Dispensing & Prototyping

The ONYX500 Production Cell is the ultimate precision, multifunctional system with a wide range of applications including:

Semiconductors
Micro Dispensing, Die Attachment, Wafer Handling
Photonics
Assembly, Dispensing, Alignment, Curing, Inspection
Micro-Mechanics
Micro Assembly, Component Packaging, Kitting/Sorting
Electronics
Assembly, Dispensing, Inspection, Repair

The ONYX500 Cell is the "production floor" version of the ONYX500 Benchtop, adding a full enclosure with safety covers and doors.

System features/benefits include a Dual Camera Vision System, Precision Force-Controlled Placement, High Performance Integrated Dispensing, Automatic Tool Changer and more.

Micro Assembly

Micro Dispensing

MEMS Kitting & Sorting

Features/Benefits:
Dual Camera Vision System
Up looking camera compares component/die/object mounted on z-axis vacuum nozzle to a model. Down looking camera compares substrate/object on the application plate to a model.

Precision Force-Controlled Placement
The component/die/object is automatically placed after the two part vision match. Various precision force placement systems are available to provide the minimum (1 grams) or maximum (20 kilograms) force required.

High Performance Integrated Dispensing
Either a time/pressure dispenser with automatic pressure compensation or an auger type dispense system can be mounted to an independent z-axis. Once these are integrated, they provide the capability to dispense/pick/align/place on a single machine. Dual z-slide drives are available as well for dispensing multiple materials.

Automatic Tool Changer
Provides the capability to store and automatically change up to twelve vacuum nozzles.

Assembly Head with Theta Rotation

Cartesian Positioning with Precision Linear Motors
& Encoders

Die Flipper

	Flexible Design Allows machine to be configured based on application requirements Custom application plate shown below.


	Technical Data Dimensions Width: 1170 mm (46”) Depth: 1170 mm (46”) Height (avg): 2403 mm (95” without stack light) Weight (avg): 600kg (1320 lbs.) Electrical Power 3 x 208/110VAC, 60Hz, 3 phase Process Accuracy (X) +/- 0,009mm (Y) +/- 0,009mm (Z std) +/- 0,020mm (Theta) +/- 0,020˚ (+/- 3 Sigma) (X) +/- 0,00035 ” (Y) +/- 0,00035 ” (Z std) +/- 0,00078 ” Safety System CE certified, UL compatible. Specifications are subject to change without previous notice. Values are based on glass flip chip placements on glass substrate. Local process accuracies of 0,005 mm can be reached depending on the application.