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Features/Benefits:
Precise Operating Control
• Solder Wave Contact:
Cycle duration automatically sets time solder contacts board.
• Solder Wave Flow Rate:
Allows level wave for any flow well shape or size. Three (3) stage settings for enhanced process control.
• Temperature:
Closed-loop control of set temperature. System can be set to 615°F (325°C).
Pumping System & Solder Pot
• Cast iron solder pot and titanium/cast iron impeller pump
are designed to withstand aggressive, lead-free solder.
• Minimal dross accumulation and level solder wave.
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Alignment System
• X, Y, Z Board Carrier - Cantilever rails, linear bearings
and rigid cast framework provides large board holding,
precision rail movement and continuous usage.
• PCB Hole Cleaning System (option) - Component is
aligned over solder wave then cleaning hood is
positioned to clean PCB barrels.
Titanium Flow Wells
• Solder flow is directed away from adjacent components.
• High pin count leads are heated simultaneously for a
quick process.
• Locating pins position the lead pattern over the wave.
• External heaters maintain uniform heat on large wells.
• Fixtures for multiple and irregularly shaped boards.
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