Air-Vac
 
 


PCBRM
System 5.2

Complete Capability for Low Volume Automated
Selective Soldering of Through Hole Components
 

 

The PCBRM System 5.2 has all of the features and benefits of the PCBRM15 Module with the addition of a two zone 18" x 24" preheater (6500 watts) and
a non-contact temperature sensor.

Incorporating preheat provides:
• Reduced time and temperature requirements for heat absorbing
assemblies or high heat alloys (lead-free).
• Minimal thermal shock, localized
PCB warpage and no component
overheating.
• Flux activation prior to soldering.
• Ability to rework thick board assemblies.

 

 

 
  Flow Well
Directional Solder Flow
 
Multi Component Desoldering
  Solder Flow
Precision Board to Wave Contact
 
 
     
 

Key Benefits:
• Lead-Free and thermally challenging assemblies
• Minimal Copper dissolution in PCB barrels
• Minimal board delamination
• Fast and uniform heating
• Precise operating controls and alignment system
• Quick component removal and soldering
• Product reliability, simple design, trouble-free operation

 

 

Specifications:
• Physical Dimensions: 76"W x 33"D x 28"H
• Solder Capacity: 35 lbs. Weight with Solder: 230 lbs.
• Compressed Air: 40-80 psi, clean moisture free
• Electrical: 45 amps @ 220V, 50/60Hz, 10000 watts

 
 

Features/Benefits:
Precise Operating Control
Solder Wave Contact:
Cycle duration automatically sets time solder contacts board.
Solder Wave Flow Rate:
Allows level wave for any flow well shape or size. Three (3) stage settings for enhanced process control.
Temperature:
Closed-loop control of set temperature. System can be set to 615°F (325°C).


Pumping System & Solder Pot
• Cast iron solder pot and titanium/cast iron impeller pump
are designed to withstand aggressive, lead-free solder.
• Minimal dross accumulation and level solder wave.

 

 


Alignment System
• X, Y, Z Board Carrier - Cantilever rails, linear bearings
and rigid cast framework provides large board holding,
precision rail movement and continuous usage.
• PCB Hole Cleaning System (option) - Component is
aligned over solder wave then cleaning hood is
positioned to clean PCB barrels.

Titanium Flow Wells
• Solder flow is directed away from adjacent components.
• High pin count leads are heated simultaneously for a
quick process.
• Locating pins position the lead pattern over the wave.
• External heaters maintain uniform heat on large wells.
• Fixtures for multiple and irregularly shaped boards.

 
  Options:
• Flow Well Heater Control Module (ST350)
• Air Cleaning System (APS)
• Fume Extraction Manifold (3005.02.040)


Recommended Spare Parts
• Drive Belt (high temp) (12467)
• Pump Bearing (set of 2) (9001.09.020)
• Thermocouple & Fitting (process) (12801) Thermocouple & Fitting (overtemp) (12802)
 
         
         
         
         
         
         
         
 
  Copyright 2008 Air-Vac Engineering