- Fast and Simple Operation
- Repeatable Process Control
- Robust Construction
- Application Flexibility
- Life of Equipment Support

Temperature • Time • Reflow
• Simply insert board and run cycle.
• High pin count leads are heated simultaneously.
• Quick removal increases production.
• Hole cleaning/soldering averages 5-15 seconds!

Repeatable Process Control

Temperature • Time • Reflow
• Process parameters are set - dwell time, flow rate, temperature and heated area.
• Reduced operator responsibility for safe selective soldering or removal on the most
• delicate or thermally challenging assemblies.
• High thermal mass (molten solder) equates to low operating temperatures.
• Operator intervention is minimized - no pressing tips or overheating solder mask
• or pads.

Robust Construction Insures Continued Usage

Alignment System
• The system is mounted on a rigid cast framework and supported on linear bearings
• for precision movement.
• Operator/board handling safety in insured.
• Robust board carrier insures quick, reliable positioning for easy X/Y (positioning
• stops), and Z location (adjustable) to the selective solder wave.
• Once set, the operator simply places the board into carrier.
• The board and solder wave are perfectly parallel for uniform and complete solder
• fillets. Compliant carrier arms account for PCB expansion.

Pumping System and Solder Pot
• Cast iron solder pot with titanium pump are designed to withstand corrosive,
• lead-free solder.
• Impeller pump design, high temperature bearings and belt insure long life.
• Simple design for trouble-free operation.
• Pump is mounted below the solder surface, minimizing dross accumulation.
• Integral cast 2500 watt heating element.
• Five (5) year warranty.
• Buy PCBRM Spare Parts Online >

Application Flexibility

Flow Well Design
• Wave configuration is a critical factor in reflow desoldering and resoldering operations.
• Flow Wells determine the solder wave, which matches the component lead pattern.
• The solder flow can be accurately directed away from adjacent components to limit
• heat exposure to sensitive areas of the assembly.

Application Specific Tooling
• Successful reflow soldering and rework is related to the flow well design.

Send your board or layout to Air-Vac for a quick response to simplify your
process and improve your productivity.
• Customer support is critical for successful solutions. Air-Vac takes responsibility for
• the process by receiving the assembly, discussing the application, quoting the flow
• well, and developing a proven process prior to shipment.

Standard Flow Wells and Cleaning Hoods
• Air-Vac maintains an assortment of standard flow wells and cleaning hoods.
• We have 23 standard size titanium Flow Wells.
• We have 23 standard size Cleaning Hoods (in conjunction with the APS option).
• The corresponding air cleaning hood positions the component over the flow well.
• After component removal, the hood directs low pressure air against the lead pattern,
• forcing molten solder to drop from the holes into the empty flow well.
• Visit Flow Well web page >

Custom Designed Flow Wells and Cleaning Hoods
• Air-Vac specializes in custom specific tooling for complex boards.
• Visit Flow Well web page >

Solder flow is directed away from adjacent components.

Custom Flow Well example, engineered for any component configuration.

Life of Equipment Support
• Air-Vac is committed to producing the highest quality rework/selective soldering systems designed with the capability and flexibility
• required to meet changing customer and industry requirements.
• The ongoing technical service and process support that we provide to our customers is a major value-added component of our total
• product offering.
• Air-Vac has continually supported its cistomers with equipment, process and technical service from the initial installation. This free
• engineering consulting is always available with every module or system.
• If you wish, an Engineering Solid Model can be emailed to you for discussion on the process and procedure solution.