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Papers/Articles
>Cold Underfill COMPONENT REMOVAL
Abstract: Newly developed, dedicated purpose precision milling machinery simplifies rework. By Bob Wettermann.
>Rework of Underfilled Components, A New Approach
Abstract: This paper describes an alternate process for reworking underfilled components that provide machine-based process control and eliminates the non-repeatable, manual processes that are currently in use.
>01005 Rework Article
Abstract: The Man/Machine Rework Interface (MMRI) on the DRS25 provides significant advantages over both hand soldering and beamsplitter-based machine rework.
>Dippable Solder Paste Paper
Abstract: This paper is an examination of the process feasibility, solder joint reliability, and materials/process compatibility of a dippable solder paste material for an area array component rework/repair process.
>Advanced Through-Hole Rework Paper
Abstract: The main objectives of this paper is to outline the reasons why the mini-pot is receiving so much attention and technical analysis in regard to lead-free PTH rework.
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